ball bonding中文是什么意思

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用"ball bonding"造句"ball bonding"怎么读"ball bonding" in a sentence

中文翻译手机版

球焊
球形焊接
球形接合，球形压接
球形接头

"ball"中文翻译 n. 跳舞会；〔俚语〕狂欢会。 give a ball ...
"bond"中文翻译 n. 〔废语〕农奴；奴隶。 adj. 被奴役的；奴隶的〔 ...
"gold ball bonding" 中文翻译 : 金丝球焊
"thermocompression ball bonding" 中文翻译 : 热压球焊
"bonding" 中文翻译 : 冰冻胶结; 搭铁线; 焊接连接，搭接; 焊线；引线连接; 加固和接地; 胶合; 接驳；连接; 接合；通电搭接; 结点结合低电阻连接成键的粘合粘结砌合键合保证单; 连接件; 密着; 母子结; 契约; 熔接; 粘结，压焊，结合，搭接; 忠诚保险; 砖石砌体砌合
"a ball" 中文翻译 : 篮球，写成
"at the ball" 中文翻译 : 在舞会上
"ball" 中文翻译 : n. 鲍尔〔姓氏〕。 n. 1.球；球状物。 2.球戏，(特指)棒球；【棒球】坏球 (opp. strike). 3.【军事】子弹，炮弹。 4.(人体上的)圆形突出部分。 5.眼球。 6.【兽医】丸剂，丸药。 7.【烹】肉[鱼等]丸子；面(粉)团。 8.【天文学】星球，天体；(特指)地球。 9.〔the ball〕 (企业等的)管理权。 10.〔俚语〕人，家伙。 a ball of string 一团绳子。 the earthly ball地球。 The ball is with you. 该你发球了；轮到你了。 an advance ball (录音机里的)滑动滚珠。 a spent ball 死弹〔冲力已尽的子弹〕。 a ball of fire 一团火；〔美国〕精力奋发的学生[实干家]；〔美俚〕特别快车。 a ball of fortune 命途多舛的人。 ball of the eye 眼球。 ball of the foot [thumb] 拇趾[拇指]底部的肉球。 be on the ball 〔美俚〕精力奋发地干，熟习内情。 carry the ball 〔口语〕负责。 catch [take] the ball before the bound 抢接飞球；先发制人。 Get on the ball ! 〔美俚〕灵敏一些! have nothing on the ball 〔美俚〕毫无本领。 have something [a lot, much] on the ball 〔美俚〕有点本事。 have the ball at one's feet [before one] 机会就在眼前。 keep the ball rolling [up] 不使(谈话)中断，不使(事业)中辍。 make a ball of 把…弄糟。 no ball 【板球】犯规的球。 on the ball 机灵，灵敏。 play at ball 打球。 play ball 打球，开始赛球；开始活动；合作，共事；行事公道。 put [leave] the ball in sb.'s court 把球踢到某人场地上〔逼他作出反应〕。 take up the ball 接下来讲；轮到，接替。 three golden [brass] ball 三个金[铜]球〔当铺的标识〕。 vt. 使成球；把…抟成丸。 vi. 成球形。 be (all) balled up 〔美俚〕混乱，着慌，不知所措，说不出话来。 ball and chain 〔美国〕附有铁球的脚镣，束缚；〔比喻〕妻，老婆。 ball and socket 球窝关节。 n. 跳舞会；〔俚语〕狂欢会。 give a ball 开跳舞会(招待宾客)。 have a ball 〔美俚〕狂欢作乐。 lead the ball 领导跳舞；开始行动。 open the ball 开始舞；领头做，取攻势。
"ball on" 中文翻译 : 活球
"no ball" 中文翻译 : 失球
"no-ball" 中文翻译 : n.,vt. 【板球】(把…裁判为)犯规投球(应输一分)。
"on the ball" 中文翻译 : 工作很出色的人; 机警的, 勤奋的, 高明的; 警惕; 看球看得准(做事有准备,有把握); 有把握
"the ball" 中文翻译 : 掉了球(失职); 击出曲线球
"adhesive bonding" 中文翻译 : 附着粘合
"aircraft bonding" 中文翻译 : 飞机搭接; 飞机搭铁; 飞机电缆连接
"aluminium bonding" 中文翻译 : 铝的键合
"aluminum bonding" 中文翻译 : 铝线热压焊
"animal bonding" 中文翻译 : 马头套
"atom bonding" 中文翻译 : 原子键结
"autogenous bonding" 中文翻译 : 自生粘合
"back bonding" 中文翻译 : 衬底接合; 反馈键
"blind bonding" 中文翻译 : 自动热压焊
"bonding accuracy" 中文翻译 : 焊接精确度
"bonding action" 中文翻译 : 连接作用
"bonding additive" 中文翻译 : 胶粘剂; 粘合剂

例句与用法

Specifications for fully automatic gold wire ball bonder
全自动金丝球焊接机技术条件
As a contrast object , gold wire ball bonding technology was also studied
金丝球键合作为对比研究对象引入本文研究范围。
Figure 7 : tail or crescent bond is the shape of the thermosonic bond on the substrate ( ball bond is on dimensions are shown in the box to the right of the figure
月牙形焊接（热超声焊的末端）的尺寸和形状直接与引线直径和毛细管的几何形状有关。
Trough the experiment , we probed to the suited mount method ( mount with 183 soldering paste ) and bonding technique ( ball bonding with the gold silks of 18 m in diameter )
通过实验，探索出了合适的贴装方式( 183焊膏贴装)和管芯键合工艺(直径18 m的金丝球焊) 。
Figure 6 : drawing3 showing wedge bonding operation on the second bond , at the substrate bondinger . figure 7 : tail or crescent bond is the shape of the thermosonic bond on the substrate ( ball bond is onthe die side )
月牙形焊接（热超声焊的末端）的尺寸和形状直接与引线直径和毛细管的几何形状有关。
Copper wire ball bonding is a new technology which is expected to replace the traditional gold wire ball bonding and is of great significance in reducing the cost and improving the reliability of microelectronic components
铜丝球键合是一种有望取代现行金丝球键合工艺的新技术,这一技术对于降低微电子元器件的成本、提高元器件的可靠性具有重要意义。
The process and mechanism of ball bonding were studied in this paper , specifically , intermetallic compounds ( imc ) formation and reliability on copper wire and aluminum alloy pad bonding joint during thermal aging were analyzed in detail
本文在对铜丝球键合工艺和原理研究的基础上,着重分析了老化过程中铜丝球与铝合金焊盘键合的金属间化合物生长及可靠性。
The whole process of copper wire ball bonding and gold wire ball bonding were compared and analyzed , and a central composite design of experiment ( doe ) approach was applied to optimize the parameters of free air ball formation process and bonding process , separately
本文首先对比分析了铜丝球键合和金丝球键合的全过程,采用实验设计分别对烧球工艺参数和键合工艺参数进行了优化。在此优化参数下,获得了连接良好的铜丝球键合点和金丝球键合点。
A reliability experiment of thermal aging was carried out for the two types of joints , scanning electron microscopy , energy dispersive x - ray spectrometer and micro x - ray diffractomer were adopted to investigate the interfacial evolution behavior of joints , and kinetics model of imc formation was established . the results show that imc growth follows the parabolic law as a function of aging time at certain aging temperature , imc growth is more sensitive to the aging temperature than the aging time , the activation energy of cu - al imc growth is 97 . 1kj / mol and the major forming cu - al imc are cual2 and cu9al4 , the activation energy of au - al imc growth is 40 . 1kj / mol and the main au - al imc are au4al and au5al2 , with au2al and aual at the interfacial periphery of joints , the rate of cu - al imc growth is about 1000 times slower than that of au - al imc , and kirkendall voids and cracks are easily appeared during thermal aging in gold ball bonds while voids and cracks are absent in copper ball bonds even after aging at 200 for 2900 hours and 250 for 169 hours
研究结果表明:金属间化合物厚度与老化时间的关系符合抛物线法则,金属间化合物的生长对老化温度比老化时间更加敏感; cu - al金属间化合物生长的激活能为97 . 1kj / mol ,老化后金属间化合物呈层状分布,主要相为cual2和cu9al4 ; au - al金属间化合物生长的激活能为40 . 1kj / mol ,主要相为au4al和au5al2 ,同时在界面周边区域生成了au2al和aual ;老化过程中cu - al金属间化合物生长速率比au - al金属间化合物生长速率小103数量级;金丝球键合点200老化96小时出现了明显的kirkendall空洞和裂纹,但铜丝球键合点200老化2900小时和250老化169小时都没有形成空洞和裂纹。